SUBSTRATE DIMENSIONS

• Substrate Size: Variable up to 700 mm x 650 mm using an interchangeable substrate tooling set

• Each system is equipped standard with one substrate tooling set; additional substrate sizes are optional

• Standard Substrate Thickness:

  1.1 mm, ±100 µm (microns)

  0.7 mm, ±100 µm (microns)

• Other substrate thicknesses optional

Substrate Alignment Stage

• Range:

  • X: ±1.5 mm

  • Y: ±1.5 mm

  • Z: 400 µm

• Resolution (x, y): 0.2 µm

• Degrees of Freedom: 6 (x, y, z, pitch, roll, theta)

Coarse/Fine Alignment

• Substrate separation during coarse alignment: 50-400 µm

• Coarse Alignment Accuracy: ±6.0 µm

• Substrate separation during fine alignment: <30 µm 

  (determined by spacer thickness)

• Fine Alignment Accuracy: ±3.0 µm

• Alignment Target Capture Range: ±500 µm

• Alignment Method: Computer analysis of digitized and filtered video images of alignment targets located on both substrates

• Alignment Algorithm: Least squares fit of three measurement points on the substrates to minimize the effect of plate runout

• Display: Real time on screen display of the three sets of alignment targets

• Microscope positions are changeable for various plate sizes

Substrate Pressing Mechanism

• Method: Air pressure applied to the top of the substrate assembly generates a highly uniform force distribution for pressing

• Alignment: Continuous alignment during pressing of substrates to prevent alignment creep

• Pressure Control: Computerized closed-loop control of applied pressure ensures process consistency; pressure setting can be continuously monitored and easily changed

• Pressure Range: 0.25 to 5 psi

• Pressure Resolution: 0.1 psi

Glue Curing

• Standard Method: UV-type flood expose

• Optional Method: Tacking at predefined locations via fiber optics from UV light source

• Peak Wavelength: 365 nm

• Bandwidth: 310-450 nm

• Irradiance of Flood Expose System: 50 mW/cm²

• Irradiance of Optional Fiber Optic Exposure System: up to 20,000 mW/cm²

Operation

• Operation is semi-automatic as a stand alone system, or fully automatic in-line as part of a cluster tool

• Computer: Industrial Pentium® PC

• Operator Interface: Windows® based Graphical User Interface (GUI) with control and status screens and real-time system diagnostics

• GUI to Factory Host Computer or Production Line Robots: RS-232, Ethernet, or USB

• On-Line Support: HTML Help Screens (Clicking on features in question will initiate an automatic search and display the explanation)

General

• Footprint: 1400 mm (w) x 900 mm (d) x 1600 mm (l)

  (Typical for 400 mm x 400 mm substrate size)

  (Machine dimensions are subject to change with system configuration)

• Clean, Dry Air Source: 12 scfm at 95-110 psi

• UV Exposure Power Source: 110 VAC, 30 A, 60Hz

• System Power Source: 110 VAC, 30 A, 60Hz

*Specifications and system configuration are subject to change without notice.